| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a CGA package of an integrated circuit. SOLUTION: A CGA package, i.e., a type of integrated circuit package is provided with an integrated circuit element 14, having at least an input/output terminal, and a printed circuit board 10 provided with a first plane and a second plane. On the first plane, a bonding pad 126 connected with the input/output terminal of the integrated circuit element 14 is provided. On the second plane, a conductive material 122 extending from the bonding pad 126 and a hole 26 are provided. The package is also provided with a conductive material 262, on which the hole 26 covers the recessed surface for providing the conduction terminal point of the overall integrated circuit package; and a conductive material, which is around the conductive material 262 that covers the recessed surface is used as a bonding pad.</p> |
