发明名称 Apparatus to clean golden plates
摘要 An apparatus to clean gold plated contact surfaces on printed circuit boards uses a printed circuit board guide and cleaning units in contact with the printed circuit board guide. A guide rail on the printed circuit board guide is adapted to guide the printed circuit board having contaminated gold plated contact surfaces. The cleaning units include grindstones to abrade the gold plated contact surfaces and rub off the contaminants. Embodiments are capable of achieving cleaning uniformity, reducing failure rate, and enhancing the quality of the products. The effectiveness of the invention permits operators to carry out other operations during the cleaning process. Practice of the present invention also provides improved operating conditions without problems such as those due to the presence of waste eraser particles.
申请公布号 US5993301(A) 申请公布日期 1999.11.30
申请号 US19970881566 申请日期 1997.06.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, WOO-SIG;KIM, CHOUL-SU;TSUKUE, MASAHARU
分类号 B08B11/00;B24B7/02;B24B7/17;H05K1/11;H05K3/26;(IPC1-7):B24B7/00;B24B25/00;B24B5/00 主分类号 B08B11/00
代理机构 代理人
主权项
地址