发明名称 |
Apparatus and method for producing electronic elements |
摘要 |
An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.
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申请公布号 |
US5992725(A) |
申请公布日期 |
1999.11.30 |
申请号 |
US19970815844 |
申请日期 |
1997.03.12 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
EGAWA, HIDEMITSU;EZAWA, HIROKAZU |
分类号 |
H01L21/60;B23K20/00;H01L21/607;H05K13/06;(IPC1-7):H05K13/06 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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