| 摘要 |
The invention relates to a method for packaging hot-melt adhesives in a film (3) which is suitable for fusing simultaneously with the hot-melt adhesive and presents no surface adhesion in the normal storage temperature range, especially at temperatures up to 50 DEG C. According to said method a defined portion of the molten hot-melt adhesive (1) is filled into the film, the filling process is interrupted so that a film area (8) following the portion remains free of adhesive, and the filling process is repeated. The film (3) is then heat-sealed in the adhesive-free area (8). According to the invention a film tube (3') filled with portions of hot-melt adhesive is produced, whereby areas (8) are situated between the portions which are adhesive-free across the full width of the film tube. The tube (3') is sealed by squeezing the hot-melt adhesive at the ends of the portions and is possibly allowed to cool. After squeezing, the film (3) is heat-sealed in the adhesive-free areas (8). This allows for especially high filling speeds and protects the portions enveloped by film (3) from running at elevated storage temperatures. The method also prevents air from being included in the film package. |
