| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of resin cracks with respect to thermal shock by stacking a build-up layer for processing a laser via on an outside of an inner layer board of both surfaces of a base material such as glass cloth or the like or a multilayer, and providing a through-hole which penetrates a multilayer circuit board by using an insulating layer as an organic base material film. SOLUTION: In both surfaces or multilayer board containing a glass cloth or paper as a base material, a glass woven fabric composite base material or the like is impregnated with an epoxy resin or the like and laminated. As the organic base material used for a build-up layer, a polyimide film, aramid film or the like of a material used for a flexible printed circuit board is suitable. As the insulating resin, a laser via type is used as object, and a thermosetting epoxy resin, polyimide resin or the like or a composition of these modified resin is used, and the resin is used by solely or two or more types are mixed. The build-up layer is formed through resin coating, film method or the like, and as the insulating layer having an organic base material as a support, a base material having no fault for processing the laser via is used as a support of the build-up layer. |
