CHARACTERISTIC INSPECTING METHOD AND DEVICE FOR SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To automatically remove a deformed lead and a defective on a lead size at the time of characteristic inspection for a semiconductor device. SOLUTION: This device is provided, in a characteristic inspecting part for carrying out characteristic inspection and screening for a diode 2, with an inspection table 6e having a supporting face 6g for supporting a main body part 2a of the diode 2 and a detecting face 6i facing to a mounted face of an outer lead 3c, and an ampere meter 6j connected electrically to the detecting face 6i of the inspection table 6e for detecting contact to the face 6i of the outer lead 3c when the diode 2 is mounted on the supporting face 6g. When the ampere meter 6j does not detect the contact to the detecting face 6i at the time of current impression to the outer lead 3c, the characteristic inspection is carried out to screen a non-defective.a defective. When the ampere meter detects the contact to the face 6i of the outer lead 3c, a shape defective of the outer lead 3c is recognized to sort the diode 2 as a defective.