| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition suitable as an insulation layer material for buildup substrates securing high soldering adhesion when insulation layers having anchoring effect are formed on such substrates by including a condensed polycyclic polynuclear aromatic resin and a specific granular resin in specified proportions. SOLUTION: This composition comprises (A) 100 pts.wt. of a condensed polycyclic polynuclear aromatic resin prepared by reaction of a raw material consisting of a condensed polycyclic aromatic compound or its mixture with a monocyclic aromatic compound with a crosslinking agent consisting of an aromatic compound having at least two hydroxymethyl or halomethyl groups and (B) 30-150 pts.wt. of at least one resin selected from phenolic resins, nylon resins and epoxy resins; wherein it is preferable that the average granular size of the component B is 1-10μm and this composition is obtained by blending the granular component B in the component A. |
