发明名称 OPTICAL MODULE
摘要 PROBLEM TO BE SOLVED: To keep the temperature of a waveguide chip constant by jointing a heat equalizing plate the face, where an array waveguide is formed of the waveguide chip. SOLUTION: A waveguide chip 7 is a quartz waveguide layer 6, which is provided on a silicon substrate 1 with an array waveguide 3 consisting of plural channel waveguides 2 wherein optical path lengths between adjacent waveguides are made slightly different from one another, and with first and second slab waveguides 4 and 5. A heat equalizing plate 10 made a good heat conducting metal is so arranged, that it may be brought into close contact with the front face of the waveguide layer 6 of the conductor chip 7 using an adhesive having a high thermal conductivity between them. A temperature compensating means 8, consisting of a Peltier element, is thermally joined on the plate 10, and this temperature compensating means 8 is controlled, based on the temperature of a temperature measuring means 9 consisting of a thermistor embedded in the plate 10. Thus, differences in optical paths for channel waveguides 2 of the array waveguide 3 are maintained constant to stabilize the wavelength of multiplexed/demultiplexed waves.
申请公布号 JPH11326658(A) 申请公布日期 1999.11.26
申请号 JP19980131838 申请日期 1998.05.14
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 NEKADO MASANOBU;OTA TOSHIHIKO;WATANABE KAZUKI
分类号 G02B6/12;(IPC1-7):G02B6/12 主分类号 G02B6/12
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