| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide resin compsn. excellent in heat resistance and dimensional stability by mixing a specific polyimide resin with a specific silicon- contg. polymer having acetylene bonds. SOLUTION: This resin compsn. is prepd. by mixing 100 pts.wt. polyimide resin comprising repeating units represented by formula I (whereinϕ<1> is phenylene, naphthylene, or a divalent group formed by connecting up to 5 arom. groups directly or via methylene or isopropylidene groups or the like provided groups of formulas, II, III, and IV are excluded; X is a direct bond, -SO2 -, -CO-, -O-, or the like; andϕ<2> is a tetravalent group formed by connecting up to 4 arom. groups directly or via a crosslinking member such as a 1-10C methylene or isopropylidene groups or the like) with 0.01-400 pts.wt. polymer component comprising a silicon-contg. polymer having repeating units represented by formula V (wherein R<1> and R<2> are each H, 1-30C alkyl, phenyl, or the like; R<3> is 1-30C alkylene, phenylene, or the like; and n is 0 or 1) and/or a cured silicon- contg. polymer.
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