| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition with extremely low molding shrinkage and excellent precision moldability, and useful as a semiconductor sealing agent, by compounding specific crushed-type silica and/or spherical silica particles. SOLUTION: This composition essentially comprises (A) 100 pts.wt. of an epoxy resin, (B) 20-120 pts.wt. of a phenol novolak resin, (C) 3-20 pts.wt. of a curing promoter and (D) crushed-type silica particles <=60μm in the maximum size and <=30μm in average size and/or spherical silica particles <=200μm in the maximum size and <=50μm in average size; wherein the component D is compounded at 130-700 pts.wt. based on a total of 100 pts.wt. of the components A and B, and it is preferable that this composition is compounded with (E) pref. 15-30 pts.wt., based on 100 pts.wt. of the component A, of a halogenated epoxy resin (in particular brominated novolak epoxy resin), (F) pref. 3-10 pts.wt., based on 100 pts.wt. of the component A, of antimony oxide and (G) glass fiber as well. |
