| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors, containing no halogenated epoxy resin or antimony trioxide, and having excellent flame retardancy and reliability and to provide a semiconductor device sealed with a cured product of this resin composition. SOLUTION: This epoxy resin composition for sealing semiconductors comprises (a) an epoxy resin, (b) a curing agent, (c) an organopolysiloxane expressed by an average composition formula, R<1> m R<2> n Si(OR<3> )p (OH)q O(4-m-n-p-q)/2 [R<1> is phenyl; R<2> is a 1-6C monovalent hydrocarbon containing no aromatic cycle or H; R<3> is a 1-4C monovalent hydrocarbon; 0.5<=(m)<=2.0; 0<=(n)<=1.0; 0.42<=(p)<=2.5; 0<=(q)<=0.35; 0.92<=(m)+(n)+(p)+(q)<=2.8] and (d) an inorganic filler. The component (c) is compounded at 0.1-50 pts.wt. based on 100 pts.wt. in total of the component (a) and (b). The component (d) is compounded at 400-1,200 pts.wt. based on 100 pts.wt. in total of the component (a) and (b). The other objective semiconductor device sealed with this epoxy resin composition is afforded with high flame retardancy. |
