| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resist releasing ability, resolution, and fine line adhesion. SOLUTION: In a photosensitive resin composition which comprises a base polymer (A), an ethylenically unsaturated compound (B), a photopolymerization initiator (C), a plasticizer (D) (especially, p-toluenesulfonamide) and a dye (E), a copolymer (al) having a weight-average molecular weight of 50,000 to 70,000 and a copolymer (a2) having a weight-average molecular weight of more than 70,000 and not more than 100,000 are included as the base polymer (A), at least one of the copolymers (a1) and (a2) having an acid number of 130 mg KOH/g, and a lophin dimer (c1) is further included (preferably, an acridine derivative (c2) is further included) as the photopolymerization initiator (C). |
