| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyarylene ether improved in adhesion to an LSI substrate without detriment to dielectric properties, film formability, heat resistance, and low hygroscopicity inherent in a polyarylene ether by (co)polymerizing one or more phenolic monomers. SOLUTION: One or more phenolic monomers are (co)polymerized to obtain a polyarylene ether containing 10-80 wt.%, desirably, 20-60 wt.%, more desirably, 30-50 wt.%, based on the total polymer, component having a molecular weight of 1,000-50,000 (in terms of the polystyrene as determined by gel permeation chromatography) and comprising 50-98 wt.% 2,6-diphenylphenol repeating units of the formula and 2-50 wt.% phenolic comonomer units. A polymer solution obtained by dissolving 2-70 wt.%, desirably, 5-30 wt.% this polyarylene ether in a solvent is applied to a porous support, and the wet film is cured by heating to obtain a polyarylene ether film having a thickness of 0.1-500μm.
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