| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject solution capable of improving the heat and solvent resistances without deteriorating the dielectric characteristics, film- forming properties and low water absorptivity and suitable for forming a polymeric insulating coating film, etc., for electrical and electronic part materials by dissolving a polyarylene ether and a specific bibenzyl compound. SOLUTION: This solution is obtained by dissolving (A) a polyarylene ether such as a polymer of 2,6-dimethylphenol and (B) a bibenzyl compound represented by the formula (R is H, a 1-20C hydrocarbon, cyano, nitro, an alkoxy or a halogen) such as 2,3-dimethyl-2,3-diphenylbutane. The concentration of the polyerylene ether solution is preferably 5-30 wt.% and a polymeric film prepared by coating a substrate with the polymeric solution and then removing the solvent is preferably heat-treated in an inert gas atmosphere to prepare a cross-linked polymer coating film. |
