发明名称 |
ADHESIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive resin composition excellent in high-temperature processability and having good adhesion even to a resin without having a polar group or a reactive functional group on the structure such as polystyrene. SOLUTION: This adhesive resin composition comprises 50-99 wt.% of an ethylene-α-olefin copolymer and 1-50 wt.% of a hydrogenated petroleum resin and has 0.865-0.975 g/cm<3> density of the adhesive resin composition or the adhesive resin composition is obtained by compounding 5-99 wt.% of the adhesive resin composition with 1-95 wt.% of a low-density polyethylene resin and has 0.865-0.945 g/cm<3> density of the resin composition. Furthermore, the adhesive resin composition is prepared by compounding 100 pts.wt. of the adhesive resin composition with 1-50 pts.wt. of a polymer completely or partly incompatible with the adhesive resin composition and has 0.875-1.175 g/cm<3> density of the resin composition. |
申请公布号 |
JPH11323040(A) |
申请公布日期 |
1999.11.26 |
申请号 |
JP19980133646 |
申请日期 |
1998.05.15 |
申请人 |
TOPPAN PRINTING CO LTD |
发明人 |
SUZUTA MASAYOSHI;FURUSAWA NOBUO;UMEYAMA HIROSHI;SEKINE NORIMASA |
分类号 |
C08L23/06;C08L23/04;C08L23/08;C09J123/04;C09J123/06;C09J123/08;(IPC1-7):C08L23/08 |
主分类号 |
C08L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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