发明名称 REINFORCED THERMOSETTING STRUCTURAL MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a fiber-reinforced prepreg useful in various uses, especially in the field of space technology, a composite material produced by using the prepreg and a structural adhesive. SOLUTION: The objective curable epoxy resin composition contains (a) one or more kinds of epoxy resins having a functionality value of about >=1.8, (b) a curing agent selected from 3,3'-and 4,4'-diaminodiphenyl sulfones and their mixture, (c) about 10-40 wt.% (based on the total composition) of a thermoplastic polyimide partially soluble or at least swellable in the epoxy resin at room temperature or a temperature slightly higher than room temperature and (c) about 5-20 wt.% (based on the total composition) of a polyarylene oligomer. The composition exhibits excellent toughness compared with a similar system containing a substantial amount of polyimide in the form of discontinuous particles before curing and free from the component (c) in cured state.</p>
申请公布号 JPH11323087(A) 申请公布日期 1999.11.26
申请号 JP19990060743 申请日期 1999.03.08
申请人 CYTEC TECHNOL CORP 发明人 FOLDA THOMAS;BOYD JACK D;TESCH HELMUT DR;WEBER THOMAS
分类号 C08J5/24;C08G59/00;C08G59/40;C08G59/50;C08L63/00;C08L79/08;(IPC1-7):C08L63/00 主分类号 C08J5/24
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