PLATING LIQUID AND PRODUCTION OF CERAMIC ELECTRONIC PART USING THAT,申请号JP19980150723-传众专利搜索

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发明名称	PLATING LIQUID AND PRODUCTION OF CERAMIC ELECTRONIC PART USING THAT
摘要
申请公布号	JPH11323568(A)	申请公布日期	1999.11.26
申请号	JP19980150723	申请日期	1998.05.13
申请人	MURATA MFG CO LTD	发明人	KAMIBAYASHI YOSHIHIRO
分类号	C04B41/88;C23C18/50;C25D3/56;C25D3/60;C25D7/00;(IPC1-7):C23C18/50	主分类号	C04B41/88
代理机构		代理人
主权项
地址

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