| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moisture resistance, heat resistance when soldered and moldability, esp. thin wall-infilling property and the like, small in coefficient of thermal expansion, high in reliability and useful as a sealant for semiconductor devices by using a specific epoxy resin, phenol resin and silicon nitride powder. SOLUTION: This composition essentially comprises (A) an epoxy resin of formula I ((n) is >=1), (B) a phenol resin of formula II [R<1> is Cp H2p+1 ; and R<2> is Cq H2q+1 ((p) and (q) are each 0 or an integer of >=1)], (C) a methyl methacrylate-butadiene-styrene copolymer resin and (D) a silicon nitride powder having a surface oxygen content of 0.5 to 15% in the SiO2 layer of the surface and a means particle size of 10 to 50μm, and more specifically comprises 25 to 90 wt.% of component D.
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