| 摘要 |
The invention concerns an electronic circuit support (9), the electronic support bearing at least one bump contact, the support comprising an insulating element (3, 12) housing the electronic circuit and bearing, on an external surface, a circuit layer defining at least one bump contact (7, 8), said bump contact being designed to be connected to said contact pad. The invention is characterised in that the support comprises at least one brittle zone (5, 6) located in the insulating element (3, 12). The invention is particular applicable in smart cards. |
