Verfahren und Vorrichtung zum Abziehen von Chips

摘要

A chip peeling apparatus (60) has a plurality of protrusions (100) which include first protrusions (100a) and second protrusions (100b) lower than the first protrusions (100a). A vacuum pump communicates through holes (106) with grooves (104) defined between adjacent ones of the protrusions (100). A UV sheet (126) is attached to chips (102), and the chips (102) are supported in the vicinity of their corners (103a SIMILAR 103d) by the tops of the first protrusions (100a). When the vacuum pump is actuated, the chips (102) and streets (122) disposed between the chips (102) are lowered, and the chips (102) are curved and supported in abutment against the tops of the second protrusions (100b). Each of the chips (102) is gradually peeled off the UV sheet (126) under a force tending to recover the original shape of the curved sheet (102). The chip peeling apparatus (60) is effective in preventing the chips (102) from being damaged and positionally deviated when the chips (102) are attracted and carried.