MULTIPLE PRINTED PANEL FOR ELECTRONIC COMPONENTS, AND METHOD FOR CONSTRUCTING BUMPS, SOLDERING FRAMES, SPACERS AND SIMILAR ON SAID MULTIPLE PRINTED PANEL

摘要

The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces (5).