Chipartiger Schaltungsbauteil und Verfahren zu seiner Herstellung

摘要

A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates (2, 3) with each other. A polyimide adhesion layer (12) is provided between the first and second substrates (2, 3) and a thin film circuit pattern (4, 5) is formed on at least one of opposite surfaces of the first and second substrates (2, 3), while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern (4, 5).