发明名称 Gehäusematerial zur Abschirmung elektronischer Komponenten gegen elektromagnetische Störungen
摘要 <p>A layered material for a housing that shields electronic components, comprising synthetic resin body reinforced with carbon fiber, which has superior mechanical properties and conductivity, and a metallic layer on its surface made of metal with high permeability, is light and endowed with high conductivity and high permeability wherein the housing prevents electromagnetic troubles of electronic components by concentrating magnetic flux from low-frequency magnetic field on the ferromagnetic layer spread on its outer surface.</p>
申请公布号 DE3936511(C2) 申请公布日期 1999.11.25
申请号 DE19893936511 申请日期 1989.11.02
申请人 KITAGAWA INDUSTRIES CO., LTD. 发明人 NAKAGAWA, ASAHARU;ENDO, MORINOBU
分类号 H01B1/22;H01B1/24;H05K9/00;(IPC1-7):H05K9/00;H01B1/18;H01B5/14 主分类号 H01B1/22
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