ELECTRONIC MODULE

摘要

The inventive module comprises a semiconductor unit (1) which is mounted on the top surface (2a) of a substrate (2). A two dimensional pin configuration (20) is provided on the bottom surface (2b) of the substrate, said pin configuration having individual outer, external contacts (16) which are located close to the substrate edge and internal contacts (14) which are surrounded all around by said outer contacts. In order to guarantee high-frequency shielding, the external contacts (16) are set on shielding potential (30) and an electroconductive shield (28) is placed on the top surface of the substrate (2a). This shield (28) covers the semiconductor unit and is also on shielding potential (30). At least one internal contact (14) is subjected to a high-frequency signal (HF).