| 发明名称 |
CLEANING COMPOSITION AND METHOD FOR REMOVING RESIDUES |
| 摘要 |
Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound; (ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quaternary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.
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| 申请公布号 |
WO9960083(A1) |
申请公布日期 |
1999.11.25 |
| 申请号 |
WO1999US10881 |
申请日期 |
1999.05.18 |
| 申请人 |
ARCH SPECIALTY CHEMICALS, INC. |
发明人 |
LEON, VINCENT, G.;HONDA, KENJI;ROTHGERY, EUGENE, F. |
| 分类号 |
C11D7/60;C11D1/62;C11D3/02;C11D3/06;C11D3/20;C11D3/24;C11D3/26;C11D3/28;C11D3/30;C11D3/34;C11D3/60;C11D7/06;C11D7/10;C11D7/16;C11D7/26;C11D7/32;C11D7/34;C11D11/00;C11D17/08;G03F7/42;H01L21/302;H01L21/304;H01L21/3065;(IPC1-7):C11D1/62 |
主分类号 |
C11D7/60 |
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