PROCESS FOR COATING SUBSTRATES WITH METALS

摘要

The invention relates to a method for metal coating of substrates with polym er surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductive polymer layer and subsequently conducting metalization. The electrically conductive polymer layer is doped with a colloidal palladium solution containing tin before the metalization step is carried out, whereby the electrically conductive polymer is poly-3,4-ethylene-dioxythiophene and is brought into contact with a copper(II) salt solution before metalization.