| 摘要 |
<p>A printed circuit board, wherein a fillet (F) is added to a portion which is a crossing (X) of wiring patterns (58b, 58c, 58d) and which forms an angle portion (C) of not larger than 90° to form a wiring pattern (58). The presence of the added fillet (F) prevents a wiring pattern at the crossing (X) from becoming thin and therefore the occurrence of a broken wire, non-concentration of stress on the crossing (X) does not cause broken wire at the wiring patterns and no bubbles remain between the crossing (X) of the wiring patterns and an interlayer resin insulation layer to enhance the reliability of the printed circuit board.</p> |
