| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage to optical transparent characteristic by providing the subject device with an aperture on window part which includes a first surface, is movable between a first position and a second position, and making the first surface close to a polishing surface at the second position rather than the first position. SOLUTION: This polishing device 100 has an aperture or window part 110 mounted with a soft diaphragm 120, and a wafer 140 under chemical-mechanical polishing operation is positioned above the device 100 while a measurement sensor 130 below it. During some or substantially all polishing steps, the aperture part 110 is positioned at a first position apart from a polishing surface of the device 100. When the aperture part 110 is moved to a second position closer to the polishing surface, the sensor 130 measures the surface of wafer 140 through the aperture part 110, and after the measurement, the aperture part 110 is returned to the first position. Since the aperture part 110 is below the polishing surface, the optical transparency is not damaged, and since the aperture part 110 comes close to the polishing surface at the time of measuring the wafer 140, some of polishing agent remained in a recessed part between the window part 110 and the polishing surface is removed, thereby giving less interference at the time of measurement on the site. |
