| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser cutting method and a device thereof which enables to restrain a thermal effect to be generated at a cutting portion and to obtain a minimum required energy density sufficiently while restraining the device from getting into enlarged size. SOLUTION: This is referred to a laser cutting method for cutting a tie bar part T being formed between lead frames 10 of a semi-conductor device, wherein a laser ray L to be oscillated from a pulse laser oscillator 1 is divided into two in correspondent with the length of the tie bar part T, and the tie bar part is cut by irradiating both end parts of the tie bar part T with the divided laser rays. |
