| 摘要 |
In the method for bringing together wafers 8, 11 in an aligned manner, the wafers 8, 11 are adjusted so that their sides facing one another are parallel, and are aligned according to directional markers provided on these sides and are then brought together in a treatment station 1. The two wafers 8, 11 are provided on substrate supports 5, 10, of which one can be moved only in one direction from the treatment station 1 into a measurement station 2 but the other can additionally be adjusted in two further coordinate directions and can be rotated slightly about a vertical axis. The measurement station contains microscope units having coaxial objectives 26, 27 directed towards one another. After the first wafer 8 has been introduced, the microscope units are adjusted to its directional markers. The wafer 8 is then returned to the treatment station and the other wafer 11 on the second substrate support 10 is introduced into the measurement station 2, where it is adjusted by its directional markers to congruence with the objectives 26 of the microscope units, and is returned in this position to the treatment station 1 and is placed on to the first wafer 8 with directional markers that are now aligned exactly with one another. An apparatus for carrying out the method is specified. <IMAGE> |
