| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer molding device which is almost free from the possibilities that unfilled voids or a die pad shift might be generated. SOLUTION: The transfer molding device is equipped with a plate 12 with a through hole 12a which slide-moves in an opening part 10 formed in the top force 20 of a die and protrudes into cavities 38, 46 from gates 36, 44. When introducing a resin into the cavities 38, 46, the plate 12 is set to be protruded into the cavities 38, 46 and the resin is caused to flow into two parts for the upper cavity 46 and the lower cavity 38 the through hole 12a formed in the plate 12. |
