发明名称 |
Overmolded electronic assembly |
摘要 |
An overmolded electronic assembly (10) and method for forming the assembly (10). The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more circuit devices (16) mounted to a circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16). <IMAGE>
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申请公布号 |
EP0959650(A1) |
申请公布日期 |
1999.11.24 |
申请号 |
EP19990201074 |
申请日期 |
1999.04.06 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BRANDENBURG, SCOTT DAVID;KOORS, MARK ANTONY;DAANEN, JEFFERY RALPH |
分类号 |
H05K3/00;H05K3/28;H05K5/00;(IPC1-7):H05K3/28 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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