发明名称 |
RESIN MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a sheet having scarce adherence of a dirt of a coin of a surface and an excellent sense of an inorganic property. SOLUTION: The resin molding comprises a resin composition obtained by blending 25 to 150 pts.wt. of an inorganic filling material with 100 pts.wt. of a resin component made of a polycarbonate and/or a polyester in such a manner that a roughness parameter represented by (height of a ridge of a central surface)/(grain size of the central surface) of the surface of the molding is 0.0080 m or less and 60 deg. gloss is 20 or less. |
申请公布号 |
JPH11320679(A) |
申请公布日期 |
1999.11.24 |
申请号 |
JP19990047796 |
申请日期 |
1999.02.25 |
申请人 |
MITSUBISHI CHEMICAL CORP |
发明人 |
KATANO HIROAKI;NAKAO SACHIKO;HASE YOSHIHIRO;FUJITANI MANABU;ODA FUMIHIKO |
分类号 |
C08J5/18;B29C59/02;B29K67/00;B29K69/00;C08K3/00;C08L67/02;C08L69/00;(IPC1-7):B29C59/02 |
主分类号 |
C08J5/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|