发明名称 RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a sheet having scarce adherence of a dirt of a coin of a surface and an excellent sense of an inorganic property. SOLUTION: The resin molding comprises a resin composition obtained by blending 25 to 150 pts.wt. of an inorganic filling material with 100 pts.wt. of a resin component made of a polycarbonate and/or a polyester in such a manner that a roughness parameter represented by (height of a ridge of a central surface)/(grain size of the central surface) of the surface of the molding is 0.0080 m or less and 60 deg. gloss is 20 or less.
申请公布号 JPH11320679(A) 申请公布日期 1999.11.24
申请号 JP19990047796 申请日期 1999.02.25
申请人 MITSUBISHI CHEMICAL CORP 发明人 KATANO HIROAKI;NAKAO SACHIKO;HASE YOSHIHIRO;FUJITANI MANABU;ODA FUMIHIKO
分类号 C08J5/18;B29C59/02;B29K67/00;B29K69/00;C08K3/00;C08L67/02;C08L69/00;(IPC1-7):B29C59/02 主分类号 C08J5/18
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