发明名称 SHEET MOLDING COMPOUND FOR DECORATIVELY MOLDING AND MANUFACTURE OF DECORATED MOLDING USING IT
摘要 PROBLEM TO BE SOLVED: To reduce the number of materials and a cost and to improve an operating efficiency by using a decorating film for one of carrier films in the case of manufacturing a sheet molding compound, placing the decorating film in a mold so that it becomes a surface of a decorative molding, and molding it by pressure heating. SOLUTION: In the sheet molding compound(SMC) sandwiched between carrier films, a decorating film for forming a surface of a molding is used for one of carrier films to constitute a decoratively molding SMC. The SMC is placed in a mold so that the decorating film becomes a surface of a molding, the other carrier film is removed, an another SMC in which the same carrier film is removed is placed at this removed part, pressure heat molded to manufacture the decorative molding. Thus, occurrence of a positional deviation, a wrinkle, a bulge or the like at the molding is prevented, and economy and operability of the pressure heat molding are improved.
申请公布号 JPH11320553(A) 申请公布日期 1999.11.24
申请号 JP19980133294 申请日期 1998.05.15
申请人 HITACHI CHEM CO LTD 发明人 HASEGAWA HIROSHI
分类号 B29B11/16;B29C43/18;B29C43/20;B29K67/00;B29K105/06;B29L7/00;B29L31/10;C08J5/04;(IPC1-7):B29B11/16 主分类号 B29B11/16
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