发明名称 |
MOLDED FLEX CIRCUIT BALL GRID ARRAY AND METHOD OF MAKING |
摘要 |
A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes or vias in the substrate which define a contact pad array on the opposite surface. The substrates are tested and acceptable, then mounted on a carrier strip with longitudinally aligned apertures. The carrier strip is typically a metal such as copper. The strip with mounted substrates is then passed to a station where an IC die is mounted on the substrate first surface, wire bonds are placed from the die to the bonding pads, and the assembly is encapsulated by auto-molding to form a package body. Subsequently, interconnecting bumps are placed on the contact pads and the assembly is removed from the strip. |
申请公布号 |
EP0958605(A2) |
申请公布日期 |
1999.11.24 |
申请号 |
EP19970922331 |
申请日期 |
1997.04.23 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
FREYMAN, BRUCE, J.;DARVEAUX, ROBERT, F. |
分类号 |
H01L23/12;H01L23/31;H01L23/48;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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