发明名称 PLANE POLISHING DEVICE AND WORK TAKEOUT METHOD
摘要 PROBLEM TO BE SOLVED: To take out a work simply by a low force without the occurrence of breakage even in a state that the work is adhered to a platen by the surface tension of polishing liquid interposed between the work and the platen. SOLUTION: In a takeout device 10 provided with a chuck means 15 for chucking a work W and an attitude control mechanism 16 to change the attitude of the chuck means 15, the work W horizontally placed on the platen 3 is chucked pointing to a horizontal, by inclining the chuck means 15 by the attitude control mechanism 16, one end of the work W is lifted and peeled from the platen 3. Thereafter, the whole of the work W is lifted and taken out from the platen 3.
申请公布号 JPH11320388(A) 申请公布日期 1999.11.24
申请号 JP19980129240 申请日期 1998.05.12
申请人 SPEEDFAM-IPEC CO LTD 发明人 HAKOMORI SHUNJI
分类号 B24B37/00;B24B41/00 主分类号 B24B37/00
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