| 发明名称 |
Apparatus and method for chamfering wafer |
| 摘要 |
<p>A grindstone and a wafer (W) are rotated at high speeds in the same direction. The rotating wafer (W) is slowly moved toward the rotating grindstone (108) to thereby gradually chamfer the periphery of the wafer (W). <IMAGE></p> |
| 申请公布号 |
EP0958889(A2) |
申请公布日期 |
1999.11.24 |
| 申请号 |
EP19990109713 |
申请日期 |
1999.05.17 |
| 申请人 |
TOKYO SEIMITSU CO.,LTD. |
发明人 |
KATAYAMA, ICHIRO;IWAKI, MASATAMI;IKEDA, KAZUMI |
| 分类号 |
B24B9/00;B24B9/06;B24B51/00;H01L21/304;(IPC1-7):B24B9/06 |
主分类号 |
B24B9/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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