| 摘要 |
A heatsink having isolated bonding pads formed on the heatsink eliminates breaking of the wire bond, lifting of the wire bond to the heatsink, and die attach material contamination of the bond. In one embodiment, the isolated bonding pad has an elevated pedestal configuration. In a second embodiment, the isolated bonding pad has an elevated pedestal configuration, so that the pedestal is also configured to lock a mold compound around the pedestal. In a third embodiment, the isolated bonding pad has an island configuration. In a fourth embodiment, the island configuration is configured to lock the mold compound formed around the island. The locking mechanism of the elevated pedestal or island prevents delamination of the mold compound to heatsink interface, preventing lifting or breaking of a wire bonded to the isolated bonding pad.
|
