发明名称 |
Electrolytic copper foil having a modified shiny side |
摘要 |
Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.
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申请公布号 |
US5989727(A) |
申请公布日期 |
1999.11.23 |
申请号 |
US19980034264 |
申请日期 |
1998.03.04 |
申请人 |
CIRCUIT FOIL U.S.A., INC. |
发明人 |
YATES, CHARLES B.;WOLSKI, ADAM;GASKILL, GEORGE;CHENG, CHINSAI T.;BODENDORF, KEITH;DUFRESNE, PAUL |
分类号 |
B32B15/08;C25D1/04;C25D5/10;C25D5/16;C25D7/06;H05K3/06;H05K3/38;(IPC1-7):B32B15/08;B32B15/20 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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