| 摘要 |
An encapsulated integrated circuit package uses a heat dissipating dam which is secured about the die to the die support. A dam constrains the outward movement of liquid glob top material during the manufacturing process. In addition, the dam provides heat dissipating properties for the integrated circuit package and may improve the structural integrity of the package as well. The dam may be efficiently applied to the die support using automated techniques, such as adhesive tape bonding.
|
