发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
A method of manufacturing a semiconductor device having a region which is partially thinner than the rest thereof is disclosed. A semiconductor thin layer is formed on an insulating layer by an annealing treatment after implanting ions into the semiconductor substrate at a predetermined depth. A semiconductor material is formed by epitaxial growing to a predetermined thickness on the semiconductor thin layer. The the insulating layer or eliminating the insulating layer and a part of the semiconductor substrate under the insulating layer is eliminated by an etching operation.
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申请公布号 |
US5989974(A) |
申请公布日期 |
1999.11.23 |
申请号 |
US19980086601 |
申请日期 |
1998.05.29 |
申请人 |
NEC CORPORATION |
发明人 |
YAMADA, KEIZO;KURIYAMA, TOSHIHIDE |
分类号 |
H01L21/306;B62D57/00;B81C1/00;B81C3/00;H01L21/205;H01L21/265;H01L21/762;H01L49/00;(IPC1-7):H01L21/30 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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