发明名称 Method of manufacturing a semiconductor device
摘要 A method of manufacturing a semiconductor device having a region which is partially thinner than the rest thereof is disclosed. A semiconductor thin layer is formed on an insulating layer by an annealing treatment after implanting ions into the semiconductor substrate at a predetermined depth. A semiconductor material is formed by epitaxial growing to a predetermined thickness on the semiconductor thin layer. The the insulating layer or eliminating the insulating layer and a part of the semiconductor substrate under the insulating layer is eliminated by an etching operation.
申请公布号 US5989974(A) 申请公布日期 1999.11.23
申请号 US19980086601 申请日期 1998.05.29
申请人 NEC CORPORATION 发明人 YAMADA, KEIZO;KURIYAMA, TOSHIHIDE
分类号 H01L21/306;B62D57/00;B81C1/00;B81C3/00;H01L21/205;H01L21/265;H01L21/762;H01L49/00;(IPC1-7):H01L21/30 主分类号 H01L21/306
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