| 摘要 |
PCT No. PCT/AU95/00738 Sec. 371 Date May 2, 1997 Sec. 102(e) Date May 2, 1997 PCT Filed Nov. 3, 1995 PCT Pub. No. WO96/14196 PCT Pub. Date May 17, 1996A mould apparatus for moulding materials such as thermoplastics includes a first layer of mould material and a second layer contiguous to the first layer. The second layer contains heating devices such as resistance wires, whereby in use, the heating devices heat the second layer so as to transfer heat to the first layer.
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