| 摘要 |
An insulating-resin dam bar made of ultraviolet-curing epoxy resin with a low adhesiveness to a leadframe is applied onto an outer lead by screen printing. After the leadframe is sealed with resin, the insulating-resin dam bar is removed by wet honing such as water-jet honing or laser irradiation. Thereafter, a resin-sealed semiconductor device is finished through normal fabrication processes.
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