| 摘要 |
In a method of manufacturing a semiconductor device including a semiconductor element and a chip carrier which has conductive leads bonded to the semiconductor element, a first resin mold portion is formed by a first resin mold portion to locate inner parts of the conductive leads together with the semiconductor element within the first resin mold portion. Thereafter, a second resin mold portion is formed to cover the first resin mold portion on a side of the semiconductor element and to uncover the first resin mold portion on another side opposite to the semiconductor element. Alternatively, a heat spreader may be attached to the semiconductor element and may be sealed by the first and the second resin mold portions.
|
