Electric component monitoring device and electronic component monitoring method

摘要

An electronic component monitoring device and method for correctly recognizing electronic components with bumps. A reflection-recognizing light emitter for emitting light toward an array of bumps on an electronic component, a transmission-recognizing light emitter for emitting light toward a background board, and a bump-recognizing light emitter for emitting light at an acute angle toward the array face of the electronic component are provided, and switchable light emitter(s) is/are switched on and off in accordance with a bump recognition method, transmission recognition method, and reflection recognition method.