发明名称 Combination nozzle and vacuum hood that is self cleaning
摘要 The invention provides a combination of a nozzle and a vacuum hood. The vacuum hood has a chamber that surrounds the tip of the nozzle and removes residue from the tip by a vacuum which flows in the chamber past the nozzle tip. This vacuum catches and removes residue from the nozzle tip and prevents the reside from interfering with the spraying action or dripping down. The method of the instant invention provides for dispensing a fluid from a nozzle without dripping fluid from the nozzle having a vacuum hood. The method comprises: (a) dispensing a fluid on a rotating semiconductor wafer through a nozzle over the wafer; (b) terminating the fluid flow through the nozzle; (c) creating an upward flow of gas about the dispensing nozzle when the flow of fluid through the nozzle is terminated; (d) capturing any fluid residue from the nozzle in the upward flow of gas; (e) removing the wafer and positioning another wafer; and (f) terminating the upward flow of gas; and repeating the process of steps (a) through (f).
申请公布号 US5988526(A) 申请公布日期 1999.11.23
申请号 US19980036974 申请日期 1998.03.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 TZENG, CHUNG-HAO;CHENG, DONG-SHIUH;CHANG, CHERNG-YUI;LIN, YUNG-KAI
分类号 B05B1/28;B05B15/04;(IPC1-7):B05B15/02 主分类号 B05B1/28
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