| 摘要 |
A radio frequency test fixture for testing a BGA module (1) comprises a number of standard spring loaded probes in sleeves (5, 6, 7), to be brought into contact with the solder balls (2, 3, 4) of the module (1). The sleeves (5, 6, 7) are fixed between two printed circuit boards (8, 9) with their ends flush with the outward-facing surfaces of the printed circuit boards (8, 9). Both ends of sleeves (5, 7) with probes for contacting solder balls (2, 3) connected to module ground, are connected to ground planes (10, 11) on the respective printed circuit board (8, 9). At least one electrically conducting impedance matching element (12-15) connected at its ends to the ground planes (10, 11) on the respective printed circuit board (8, 9) extends adjacent to and in parallel with each sleeve (6) with a probe for contacting a solder ball (3) connected to an RF I/O terminal on the module (1). |
