Haftverfahren für CD-Platte

摘要

A system for fabricating a bonded disk (D53), comprises an adhesive supplying section (AS,N) for supplying a liquid adhesive on a first disk (D51), a disk handling section (R1,T1,T2) for mating the first disk (DS1) with a second disk (DS2), a spin coating section (CH2,CH1,R2,EH) for spreading the adhesive between the first and second disks and a curing section (UV1,T3,A1,A2,A3,A4,LL) for curing the adhesive. The disk handling section comprises a disk transfer mechanism (R1) for arranging the first and second disks in a confronting state in which the first and second disks confront each other and the adhesive supplied to the first disk is interposed between the first and second disks, and for transferring the first and second disks to the spin coating section (CH1,CH2,R2,EH) so that the first and second disks remain in the confronting state.