High density bottom leaded package stack of integrated circuits

摘要

The stack includes a first component (10) with external voltage connection lines (11) whose front ends pass out of the base of the and extend over a side surface to the upper side. Lower feed line sections (111) are provided on the underside, lateral feed line sections on the side surfaces, and upper feed lines upper side. A second component (20) has external voltage connection lines (21) whose front ends pass through the base of the component and connect with the voltage connection lines of the first component. An Independent claim is also included for a method of manufacturing a BLP stack of integrated circuits.