发明名称 FOAMED HOUSING FOR A CIRCUIT BOARD
摘要 <p>A circuit board assembly includes a substrate to which a plurality of electrically connected electrical components are mounted. A foam housing is molded to the substrate, around and among the plurality of components. Attachment structure is molded integrally with the foam housing, for attaching the circuit board assembly to a vehicle.</p>
申请公布号 WO1999059225(A1) 申请公布日期 1999.11.18
申请号 US1999009818 申请日期 1999.05.04
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址